diamond segment, diamond saw blade, diamond wire saw, diamond fickert, floor polishing pad, flexible polishing pad
diamond segment, diamond saw blade, diamond wire saw, diamond fickert, floor polishing pad, flexible polishing pad
Place of Origin: Fujian, China (Mainland)
Brand Name: JDK
RPM: 4500
Pad Material: Resin+Diamond
Outer Diameter: 100mm
Size: 4“
backer: VELCRO
color: white
grit: 1,2,3
usage: diamond flexible polishing pads for stone polishing
type,: wet and dry
thickness: 3mm
package: white box or as your request
Feature & Advantage
Feature:
1. Velcro backing allows for fast pad changes.
2. Pad backs are color-coded for easy grit size identification.
3. Suitable for the grinding process of the curved or polygon surface
4. White buff is used for polishing light color stone finally, and black buff for dark color.
Advantage:
1. High gloss finishes in very short time
2. Never mark the stone and burns the surface of the stone
3. Different granularities and sizes as requested
4. Superior quality at very reasonable price
5. Good after-sale service and professional technical assistance.
Attention
1. The wet polishing pad is suitable used with water mill,ground from coarse to fine,then the final polishing.
2. Grinding stage need sufficient cooling water,but a little water needed to the polishing stage,finally using BUFF polished wafer to achieve a better light effect.
3.The best speed of the water mill is 4500r/min,the maximum line speed is 22.5m/s.,we can choose different styles of products according to our different habits and requirements .
4.The dry polishing pad can be directly used without adding water.
Our Services
1. MOQ: Any quantity you need is welcomed.
2. Customized Design: We can produce according to your request.
3. Good Service: We treat you need with high professionalism and passion.
4. Good Quality: Strict quality control system.Products get great feedback from customers.
5. Fast Delivery: We can delivery our cargo in 7 days, as soon as possible.
6. After Sale Service: Professional Technical Support.