Segment, saw blade, wire saw, polishing pad, grinding pad, machine
Segment, saw blade, wire saw, polishing pad, grinding pad, machine
Specification
1. For polishing hard metal, alloy, diamond, glass, and many material.
2. For making diamond tools, like diamond saw blade, diamond grinding wheel, PCD, PDC.
3. For making jewlery.
Type and size
- Diamond micron powder: From 0.25micron up to 50 micron
- Diamond mesh powder: Grit No.: From 30/40 up to 500/600
- Coated synthetic diamond: Nickel 30% and 56%, Ti 56% and 30%
-Single crystal: Diameter 1.2mm, 1.5mm, 1.8mm, 2.0mm, 2.2mm, 2.4mm
- Polycrystalline diamond compact 10mm*0.75mm, 2.5mm*1mm, 3.2mm*1mm etc
Grain Size |
|
FEPA |
Mesh |
Grain Code |
Grain Code |
||
600/425 |
30/40 |
D602 |
40# |
425/355 |
40/45 |
D426 |
45# |
355/300 |
45/50 |
D356 |
50# |
300/250 |
50/60 |
D301 |
60# |
250/212 |
60/70 |
D251 |
70# |
212/180 |
70/80 |
D213 |
80# |
180/150 |
80/100 |
D180 |
100# |
50/125 |
100/120 |
D151 |
120# |
125/106 |
120/140 |
D126 |
140# |
106/90 |
140/170 |
D107 |
170# |
90/75 |
170/200 |
D91 |
200# |
75/63 |
200/230 |
D76 |
230# |
63/53 |
230/270 |
D64 |
270# |
53/45 |
270/325 |
D54 |
325# |
45/38 |
325/400 |
D46 |
400# |