Micron Diamond Powder

Our micron diamond are manufactured from selected quality raw materials(diamond grits), which shows fabulous performance in grinding, lapping, polishing and finfishing in the field of resin bond, vitrifed bond and electroplated applications.


The Factors of the quality:
1. Raw Materials: Raw materials play a very important role for micron consistency, which influence the strength and durability. Our raw materials are from consistent sources and will be tested before processing.

2. Particle Size Distribution: Particle Size Distribution (PSD)is a primary factor for micron quality, which decide the materials’ removal rate and surface roughness. The PSD are strictly controlled in the process of manufacturing for ensuring the consistency and reproductibility.

3. Particle shape: Particle shapes determines the polishing surface result, so the consistent crystal shapes are very important. With advanced production equipments and experienced staff, the long and flaky particles are strictly controlled to keep more uniform, block and three dimensional particles.

4. Oversize & Superfines Control: Oversize is also the key for the surface finish of the workpiece. And superfines affects the removal rate. Our specially designed equipments to control the oversize and superfines guarantee more effective particles during work.

5. Surface/ Purity / Cleanliness: The surface cleanliness affects the particle dispersion and bond retention. Which is definitely the key element that should be concerned by us. And for special purpose, special treatment will be done according to the customers’ requirements.


Grades:

MD-H (Micron Diamon for Diamond Wire)
Characteristics: Raw material with high strength, high purity, highly controlled distribution. Uniform blocky shape, very clean particle surface.

Applications: Used in vitrified, metal bond systems and electroplated tools. Suitable for precision polishing of optical glass, advanced ceramics, semiconductor, SiC and sapphire wafer, precision machining tools. Slicing and notch of sapphire and SiC, etc.

MD-M(Micron Diamond for Metal Bond)
Characteristics: Raw material with medium toughness. Blocky crystal shape with narrow particle size distribution, low impurity.

Applications: Used in resin, vitrified, metal bond systems and electroplated tools. For precision grinding/polishing of brittle materials, like optical glass, ceramics, PCD, etc. Also used for high grade slurry and compound, etc. N30, N56 and Ti coated products are available.

MD-G(Micron Diamond for General Usage)
Characteristics: Irregular crystal shape with relatively concentrated particle size distribution, low impurity content. High removal rate.

Applications: Widely used in resin, vitrified, metal bond systems and electroplated tools. Recommended for grinding and polishing stones, tiles, concrete, jade & gems, etc. Also used for making polishing slurry and paste,etc.


MD-E(Economic Micron Diamond)
Characteristics：Raw material with high-friability. Irregular crystal shape and relatively wide range of particle size distribution.

Applications: Mainly used in resin and vitrified bond system. Suitable for low load grinding and polishing applications, like stones, floor tiles, Jade & gem, etc.

MD-R(Micron Diamond for Resin Bond)
Characteristics：Resin bond diamond micron powder, light gray color, blocky shape, friable multicrystalline structure, concentrated particle size distribution. Good self-sharpening ability allows the crystal to continuously generate new cutting edges.

Applications: Recommended for resin bond vitrified bond systems. Bring excellent performance in Tungsten carbide, hard alloy, glass, ceramics, crystals grinding and polishing where high surface finish is required.


MD-P(Polycrystalline Micron Diamond)
Characteristics：An polymer of nano diamond produced by means of detonation. Polycrystalline micron diamond powders consists of nano-crystallines that give it a unique break down mechanism which allows new cutting edges to be exposed creating self-sharpening characteristics.

Applications: MD-P is ideal for lapping applications requiring a high stock removal and a controlled surface finish.


DND (Nano Sized Diamond)
Nano-diamond is formed by use of the free carbon generated by explosion with negative oxygen balance, under the action of pressure and temperature created by the detonation waves.
Characteristics: DND diamond has excellent wear resistance, corrosion resistance and thermal conductivity, high dispersion stability and super-smooth polishing.

Applications: Applied in polishing and grinding hard drive, magnetic head, precious stones, ceramic, glass and hard alloy. Also applied in oil or lubricant additive, which can significantly improve friction performance and extend life span.


MD-PCD(Micron Diamond for PCD/PDC Synthesis)
Characteristics: Raw material with high strength. Blocky crystal shape, concentrated particle size distribution, very low impurity, especially low Si content, particle surface is very clean and specially purified, good thermal stability and wear resistance.

Applications: Specially designed for producing PCD/PDC and wire drawing die, also used in metal bond, vitrified bond system and electroplated tools.

MD-DWN30(Micron Diamond for Diamond Wire)
Characteristics: Raw material with high toughness. Regular and consistent crystal shape, clean surface, high toughness, good thermal stability and wear resistance, critical oversize particles control, strictly control the width and length ratio of diamond particles to ensure the concentrated particle size distribution and high content of effective grinding particles.

Applications:Designed for producing diamond wire and other cutting/slicing tools for monocrystalline and polycrystalline silicon, saphire, semiconductor, LCD glass, magnetic materials, etc.

Grades & Sizes Available Chart: